Andrew Dieckmann

Andrew Dieckmann
Andrew Dieckmann
Vice President, Microsemi Corporate

Andrew Dieckmann is the Vice President of Marketing and Applications Engineering at Microsemi Corporation. He has more than 15 years of experience in this field and is associated with Microsemi since 2001. Andrew is a graduate from Lakehead University, having completed his Bachelor of Engineering in Microelectronics and Communications.

Specialisation:

Server Storage, Data Center storage solutions, Flash and SSD storage, SATA, SAS (Serial Attached SCSI) technology, PCI Express, NVMe, Encryption