HID Cardlam prelaminated inlay for e-ID Cards

Technical Specification

Features:
  • Make: HID
  • Model code: Cardlam
  • Card/ Tag/ Fob: Card
Additional info:

HID Global's card inlays provide card manufacturers with the highest level of reliability, durability and card structure design versatility. Prelaminates are available with HID SOMA chip operating systems and third-party chip operating systems. HID Cardlam™ products are optimised to extend the finished card's lifespan. Manufactured using patented HID’s Wire Transfer, or classic wire embedding technologies, our polycarbonate, PET and PVC prelaminates provide full protection of the electronic components. Cardlam™ CPFCardlam CPF includes an ultra-thin ceFLEX™ mechanical shield providing crack prevention capabilities for extended e-ID card lifespan. Cardlam™ UTOver 40% thinner, our Ultra-Thin 200 micron polycarbonate inlays with DBond™ technology give document makers more room to compose complex eID card ISO structures and include security features on various inner layers than traditional 350-400 micron counterparts. Key Features Thin – Built with the slimmest and most flexible laminate and module or chip Durable – Patented technology and card construction make it exceptionally strong and resistant to everyday wear and tear Reliable – Optimum chip performance especially with SOMA™ Chip Operating Systems Flexible – Customised layout to match with card manufacturers requirements Compliant – Exceeds relevant ISO and ICAO standards

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Make HID
Manufacturer HID Global
Model code Cardlam
Card/ Tag/ Fob Card
Additional info

HID Global's card inlays provide card manufacturers with the highest level of reliability, durability and card structure design versatility. Prelaminates are available with HID SOMA chip operating systems and third-party chip operating systems.

HID Cardlam™ products are optimised to extend the finished card's lifespan. Manufactured using patented HID’s Wire Transfer, or classic wire embedding technologies, our polycarbonate, PET and PVC prelaminates provide full protection of the electronic components.

Cardlam™ CPF
Cardlam CPF includes an ultra-thin ceFLEX™ mechanical shield providing crack prevention capabilities for extended e-ID card lifespan.

Cardlam™ UT
Over 40% thinner, our Ultra-Thin 200 micron polycarbonate inlays with DBond™ technology give document makers more room to compose complex eID card ISO structures and include security features on various inner layers than traditional 350-400 micron counterparts.

Key Features

  • Thin – Built with the slimmest and most flexible laminate and module or chip
  • Durable – Patented technology and card construction make it exceptionally strong and resistant to everyday wear and tear
  • Reliable – Optimum chip performance especially with SOMA™ Chip Operating Systems
  • Flexible – Customised layout to match with card manufacturers requirements
  • Compliant – Exceeds relevant ISO and ICAO standards
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