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StarChip expands its range of SIM controller with the addition of SCF670H

Published on 22 February, 2013

StarChip, experts in designing, qualifying and industrialising Smart Card ICs recently announced that it is currently sampling the SCF670H product, its latest SIM controller designed to tackle the booming 4G/LTE market. The SCF670H is the latest member of a family introduced a few months ago with the SCF335H. This family aims at covering the whole Telecom market from Native to high-end SWP through USIM Java Card and 4G/LTE applications. Following member of this family addressing Native sub-segment will be introduced in a few weeks.

Based on Cortus APS3s 32bit CPU, the SCF670H enables 25Mips@25MHz across a broad spectrum of temperatures and offers advanced low power modes. Alongside a 24KB static RAM it integrates a 670KB unified flash memory that provides robust data retention (>25years) with several hundred millions cycles of endurance thanks to the E3 (ECUBE) mechanisms and is fully compatible with 4FF module packaging. The memory size of the SCF670H can be tailored to customers’ requirements by a simple configuration to be done at the customer premises or on the field.

The feature set of the SCF670H fully satisfies manufacturers’ requirements for high-performance smart card enabling smooth implementation of the newest applications defined in the latest standards like the ISIM application (IP Multimedia Subsystem SIM). This announcement also demonstrates the capacity of StarChip® to become a long-term leading supplier to the Smart Card ICs market by quickly offering solutions that satisfy market requirements.

“The high memory capacity, among other parameters of the SCF670H is one of the key aspects that supports the growing international demand for data intensive features in next generation mobile handsets”, said Yves Fusella, CTO of StarChip®. “While SCF670H will expedite the introduction of higher performance smart cards and multimedia services for 4G/LTE mobile phones we are currently working on enhanced 90nm and beyond technologies for our next products”.

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